Simulation study on the effect of SiO2 mold on solidification process of 33#AZS melt

摘要

By using COMSOL Multiphysics software to simulate the solidification process of 33# AZS melt in the SiO2 mold,and analyzing the change of temperature、liquid percentage and conductive heat flux in casting with the time going,we can get conclusions:temperature、liquid percentage and conductive heat flux of the casting change most quickly at four comers,while slowly in the center area; when setting the size of casting as 200 mm×300 mm× 500 mm,it will produce thermal stress easily due to the larger temperature difference in casting at 160 mm～200 mm in width and 460 mm～500 mm in length and four comers,when the thermal stress exceeds the material strength,cracks will be produced and result in reject products.