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A New Method for Measuring the Thickness of Tin Coating Layer on the Mobile Phone Case

机译:一种测量手机外壳锡涂层厚度的新方法

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The Tin coating thickness has significant influence on the quality of the mobile phone case product.It is very difficult to obtain the Tin coating thickness using conventional testing method.This paper proposes a new technique for efficient and accurate measuring the Tin thickness plated on the surface of mobile phone case products through analyzing the section image of the product derived from SEM.A computer image analysis has been carried out to obtain the thickness of the Tin coating.In the paper,we describe the detailed sample preparing processes which involve the use of rubber container,clamp,PS resin,firming agent,polishing machine,3000 mesh sanding paper,silk,SEM and other tooling,scanning the sample section with SEM to obtain the image in computer and analyzing the image in the computer.This new method is very efficient and quite accurate,thus can be used in the production line to monitor the Tin coating thickness to help control the product quality.
机译:镀锡层厚度对手机外壳产品的质量影响很大,采用传统的测试方法很难获得镀锡层厚度。本文提出了一种新的技术,可以有效,准确地测量镀在表面上的镀锡层厚度通过分析从SEM得到的产品的截面图像来分析手机外壳产品。进行了计算机图像分析以获得锡涂层的厚度。在本文中,我们描述了详细的样品制备过程,其中涉及使用橡胶容器,夹子,PS树脂,固化剂,抛光机,3000目砂纸,丝绸,SEM等工具,用SEM扫描样品切片以在计算机中获取图像并在计算机中分析图像。这种新方法是非常高效且非常准确,因此可以在生产线中用于监控锡涂层的厚度,以帮助控制产品质量。

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