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Determination of the Performance Of Chip seal, Applied With HSKSC (Accelerated Chip seal Simulation Device) on Unbound Base

机译:HSKSC(加速芯片密封仿真装置)在未结合的基体上确定芯片密封的性能

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Chip seals applied on unbound granular base are an asphalt pavement type that is widely used in countriessuch as Turkey, Australia, New Zealand, and South Africa. Although several methods and techniques regardingdesign of chip seals and measurement of performance of chip seal on-site and under laboratory conditions have beendeveloped in recent years, there is no evidence that a device, system or method, allowing cost-effectively pre-measurement of performance of chip seals, existed in laboratory setting. In this study, Accelerated Chip SealSimulation Device (HSKSC), which was developed and designed in Suleyman Demirel University (Turkey) andallows measurement of chip seal, applied on unbound granular base, under laboratory conditions and desired climateconditions as described, and results of two different performance tests performed with this device were discussed.Two different chip seals (single-layer and double-layer) were designed with this device and double-layer, single-layer chip seal samples were subjected to performance test in the device under a mild climate and hot climaterespectively. During the tests, macro surface texture and numbers of friction-skid resistance were measured. As thenumber of cycles increases considerable decrease appeared particularly on macro texture and a limited decrease inmicro texture. It was concluded that the performance tests to be carried out by means of prototype Accelerated ChipSeal Simulation Device (HSKSC) would be useful for design of chip seal applied on unbound granular bases.
机译:在未结合的颗粒状基体上使用的碎屑密封剂是沥青路面类型,已在许多国家/地区广泛使用 例如土耳其,澳大利亚,新西兰和南非。尽管有关以下几种方法和技术 芯片密封的设计以及现场和实验室条件下芯片密封性能的测量 近年来开发的产品,尚无证据表明有一种设备,系统或方法可以经济有效地预先 实验室环境中存在对芯片密封性能进行测量的方法。在这项研究中,加速芯片密封 仿真设备(HSKSC),由Suleyman Demirel大学(土耳其)和 允许在实验室条件和所需气候下测量未密封颗粒状基体上的切屑密封性 讨论了上述条件,并讨论了用该设备执行的两次不同性能测试的结果。 此设备设计了两种不同的芯片密封件(单层和双层),双层,单层 在温和的气候和炎热的气候条件下,对器件中的层芯片密封样品进行性能测试 分别。在测试过程中,测量了宏观表面纹理和抗摩擦滑动性的数量。作为 循环次数增加,特别是在宏观纹理上明显减少,而有限的减少 微纹理。结论是,将通过原型加速芯片进行性能测试 密封仿真设备(HSKSC)对于设计应用于未结合的颗粒状基料的芯片密封非常有用。

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