SILVER/METALLIC GLASS PASTE FOR SHALLOW EMITTER SI-SOLAR CELL

摘要

Cu and Al-based metallic glass (MG) frits have been applied as a substitution for oxide glass (OG)ones of screen printed Ag on Si solar cell. Use of electroconductive MG frits significantly improved the quality ofthe contact. In case of Cu-Zr-based MG frits, highly dense 10–50 nm size Ag crystallites were formed and veryshallow Ag crystallite penetration depth of 10–30 nm led to smooth interface. Nanoscale Ag crystallites form on theemitter surface by local Si–Cu–Ag eutectic melting, leading to the formation of pyramidal pits on the Si emittersurface, followed by precipitation of Ag crystallites during cooling. The specific contact resistance (ρ_c) and electricalresistivity (ρ) of Cu MG added electrode were 5.4 mΩcm~2 and 2.3 μΩcm, respectively. The Al-based MG reducedthe resistivities further down to 0.6 mΩcm~2 and 3.2 μΩcm, respectively. The results are promising to replace metalplating technique to screen printing one.