首页> 外文会议>Proceedings of the Twentieth Asian Test Symposium >Yield-per-Area Optimization for 6T-SRAMs Using an Integrated Approach to Exploit Spares and ECC to Efficiently Combat High Defect and Soft-Error Rates
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Yield-per-Area Optimization for 6T-SRAMs Using an Integrated Approach to Exploit Spares and ECC to Efficiently Combat High Defect and Soft-Error Rates

机译:使用集成方法利用备用件和ECC来有效应对高缺陷率和软错误率的6T-SRAM的单产优化

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Memories constitute increasing proportions of most digital systems and memory-intensive chips lead the migration to new nanometer fabrication processes. With each process generation, process variations and defect rates are increasing, at the same time, cells are becoming more susceptible to soft errors with technology shrink. SRAMs will thus require increasing numbers of spares and stronger error correcting codes (ECCs), incurring higher area overheads and access-time penalties. Our overall objective is to develop new systematic approaches for designing defect-tolerant 6T-SRAMs optimized in terms of yield-per-area under high defect rates and high soft error rates, for given soft-error resilience and access-time requirements. In this paper, we analyze the key tradeoffs associated with using different numbers of spares and ECCs with different strengths. In addition to considering the usual role of each -- i.e., spares to combat defects and ECC to combat soft errors -- we also consider the ability of ECC to combat those defects which cannot be masked using available spares. We develop a new model that captures the benefits -- yield and resilience to soft errors -- of spares and ECC in an integrated manner. We also characterize area and access time overheads of the spares and the ECC scheme. We then integrate above into a framework to design 6T-SRAMs that optimizes yield-per-area. We demonstrate that the proposed approach provides dramatic improvements in yield and yield-per-area without compromising resilience to soft errors.
机译:内存在大多数数字系统中所占的比例越来越高,内存密集型芯片导致向新的纳米制造工艺的迁移。随着每一代工艺的发展,工艺变化和缺陷率不断增加,同时,随着技术的发展,单元越来越容易受到软错误的影响。因此,SRAM将需要更多的备用件和更强的纠错码(ECC),从而导致更高的区域开销和访问时间损失。我们的总体目标是针对给定的软错误回弹性和访问时间要求,开发新的系统方法,以设计在高缺陷率和高软错误率下按面积合格率进行优化的容错6T-SRAM。在本文中,我们分析了与使用不同数量的备件和具有不同强度的ECC相关的关键权衡。除了考虑每个组件的通常作用-即用于解决缺陷的备件和用于解决软错误的ECC-我们还考虑ECC应对那些无法使用可用备件掩盖的缺陷的能力。我们开发了一种新模型,该模型以集成方式捕获了备件和ECC的收益-收益和对软错误的抵御能力。我们还描述了备用件和ECC方案的面积和访问时间开销。然后,我们将以上内容集成到一个框架中,以设计可优化单位面积产量的6T-SRAM。我们证明了所提出的方法可以显着提高产量和单位面积的产量,而不会影响对软错误的恢复能力。

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