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Elimination of half select disturb in 8T-SRAM by local injected electron asymmetric pass gate transistor

机译:通过局部注入电子不对称传输门晶体管消除8T-SRAM中的半选择干扰

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8T-SRAM cell with asymmetric pass gate transistor by local electron injection is proposed to solve half select disturb. Two types of electron injection scheme: both side injection scheme and self-repair one side injection scheme are analyzed comprehensively for 65nm technology node 8T-SRAM cell and also for 6T-SRAM cell. This paper shows that in the 6T-SRAM with the local injected electrons [4] the read speed degrades by as much as 6.3 times. In contrast, the proposed 8T-SRAM cell with the self-repair one side injection scheme is most suitable to solve the conflict of the half select disturb, write disturb and read speed. In the proposed 8T-SRAM, the disturb margin increases by 141% without write margin or read speed degradation. The proposed scheme has no process or area penalty compared with the standard CMOS-process 8T-SRAM.
机译:为了解决半选择干扰问题,提出了具有通过局部电子注入的不对称通过栅晶体管的8T-SRAM单元。针对65nm工艺节点8T-SRAM单元和6T-SRAM单元,全面分析了两种类型的电子注入方案:侧注入方案和自修复单侧注入方案。本文表明,在具有局部注入电子的6T-SRAM中,[4]的读取速度下降了6.3倍。相反,提出的具有自修复一侧注入方案的8T-SRAM单元最适合解决半选择干扰,写入干扰和读取速度的冲突。在提出的8T-SRAM中,干扰容限增加了141%,而没有写容限或读取速度下降。与标准的CMOS工艺8T-SRAM相比,该方案没有工艺或面积损失。

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