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Phase Change Memory and paradigm shift to in-system programming

机译:相变存储器和范式转移到系统内编程

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Phase Change Memory (PCM) has recently gained momentum in the semiconductor industry as a viable alternative to flash memory due to the fact that flash (NOR and NAND) and DRAM memory technologies are expected to encounter scaling difficulties as chip lithography shrinks, and various unique properties PCM offers[1,2]. The PCM cell has been shown to scale down below 10nm as it uses the unique properties of Chalcogenide glass which can be reversibly “switched” between crystalline (low resistance) and amorphous (high resistance) states with application of heat[3]. This unique temperature property, however, will impose a paradigm shift from off-board pre-programming to in-system programming (ISP) in the manufacturing flow. Any code needed to be stored in the PCM has to be programmed after the surface mount technology (SMT) process. There are several methods already employed in the industry that will facilitate this paradigm shift to in-system programming. This paper attempts to consolidate and describe these methods.
机译:相变存储器(PCM)最近在半导体工业中获得了发展成为闪存的可行替代方案的动力,这是因为随着芯片光刻技术的发展,闪存(NOR和NAND)和DRAM存储器技术预计会遇到扩展困难,并且各种独特PCM提供的属性[1,2]。 PCM电池已被证明可缩小至10nm以下,因为它利用了硫族化物玻璃的独特特性,通过加热可以在晶体(低电阻)和非晶(高电阻)状态之间可逆地“切换” [3]。然而,这种独特的温度特性将使制造流程中的模式从板外预编程转变为系统内编程(ISP)。在表面贴装技术(SMT)处理之后,必须对需要存储在PCM中的任何代码进行编程。工业界已经采用了几种方法来促进这种模式向系统内编程的转变。本文试图巩固和描述这些方法。

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