Relationship between Removal Rate and Friction Force of a CMP Process for MEMS

摘要

One of the main quantifying characteristics of Chemical-mechanical Polishing (CMP) process is its removal rate. Assuming that there is a relationship between the removal rate and the friction force, the controlling of the removal could be achieved by monitoring the friction during the process. For this purpose, the outcomes of the CMP process (removal rate and friction force) were analyzed as a function of the main input parameters like applied pressure, rotational speed, and slurry supply rate using a statistical method, a full-factorial Design of Experiments (DoE). As a result, all the input parameters exhibit the same influence on both outcomes, which makes the removal quantifiably determinable by friction.