首页> 外文会议>Society of Plastics Engineers Annual Technical Conference >EFFECT OF THERMAL CONDUCTANCE TO MOLD ON THE TEMPERATURE RISE MEASURED BY RESIN TEMPERATURE SENSORS
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EFFECT OF THERMAL CONDUCTANCE TO MOLD ON THE TEMPERATURE RISE MEASURED BY RESIN TEMPERATURE SENSORS

机译:模具的导热系数对树脂温度传感器测得的温升的影响

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In order to identify the resin state precisely, the measured temperature should be closer to the actual resin temperature and sensitive to the resin temperature variation. In an absolute sense of view, the measured temperature by the resin temperature sensor is a mold wall temperature. In this study, we examined the effect of thermal conductance through the sensor from the resin to mold on the temperature rise measured by the sensor. In experiment we tested a thermally insulated washer and an insulation block to reduce the thermal conductance. To examine the influence of thermal conductance of mold material, the temperature rise of mold wall was calculated with different thermal conductivity of the mold by transient-heat-transfer numerical simulation.
机译:为了精确地识别树脂状态,测得的温度应更接近实际树脂温度并且对树脂温度变化敏感。从绝对的角度来看,由树脂温度传感器测得的温度是模具壁温度。在这项研究中,我们检查了从树脂到模具通过传感器的热传导对传感器测得的温度升高的影响。在实验中,我们测试了隔热垫圈和隔热块以降低热导率。为了研究模具材料导热系数的影响,通过瞬态传热数值模拟计算了不同模具导热系数下模具壁的温升。

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