THREE-DIMENSIONAL SIMULATION OF MULTI-SHOT SEQUENTIAL MOLDING

摘要

For the recent years, multi-shot sequential molding is widely applied in various industries. It is a process that uses two or more molds to produce a multi-material component. In principle, the first material is injected into the first mold by standard single-material molding technique and then moved to the next mold where the next material can be injected to combine with it. This complex process is difficult to identify and study correctly by the traditional 2.5D model. In this paper, a three-dimensional numerical approach is developed to simulate the filling, packing and cooling stages in multi-shot sequential molding, as well as the part warpage after ejection. Several cases are reported to indicate the success of the present model.