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Influence of temperature and length of splicing areas on the loss of joints of single mode telecommunication fibers

机译:温度和熔接区长度对单模电信光纤接头损耗的影响

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Diffusion processes in thermally diffused expanded-core (TEC) of single mode telecommunication fibers areas, at temperatures t=1900°C ÷ 2000°C were presented in the paper. The loss of TEC areas of thermally connected telecommunication fibers of different types (G.652 and G.655) in above mentioned temperatures of splicing was theoretically analyzed and counted. In the analysis the loss resulted from the mismatch of mode fields of connected fibers and at the same time the mismatch of the dimensions of transit areas were taken under consideration. Presented analysis allows, assuming the knowledge of the values of core dopant diffusion coefficients, the temperature and the time of splicing, to predict the loss of splicing of different types telecommunication fibers. Consistence of the theoretical calculations with experimental data of thermal connected telecommunication fibers with significantly different parameters, was proved.
机译:本文提出了在温度为t = 1900°C÷2000°C的单模电信光纤区域的热扩散扩展纤芯(TEC)中的扩散过程。从理论上分析并计算了上述熔接温度下不同类型(G.652和G.655)的热连接电信光纤的TEC面积损失。在分析中,损耗是由于连接光纤的模场不匹配而引起的,同时还考虑了传输区域尺寸的不匹配。假设对核心掺杂物扩散系数的值,温度和熔接时间有所了解,当前的分析就可以预测不同类型电信光纤熔接的损耗。证明了理论计算与参数显着不同的热连接电信光纤的实验数据的一致性。

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