Miniaturized Onboard System Components

摘要

The introduction of stacked multi-chip-module (MCM) in 3D-System-in-Package (3D-SIP) enables a new level of integration in satellite systems, where the complete chain, from individual IC dies to system interfaces are miniaturized. Angstrom Aerospace Corporation has developed this concept, starting on the component packaging level, aiming for a step-by-step introduction of new standardized and modular satellite systems featureing plug and play. Three modules have been developed to demonstrate the technology and its performance. A general interface module (Remote Terminal Unit, RTU), a compact solid state mass memory module (MM) and a magnet torquer control module (MACS). The high packing density is achieved by MCM-D technology, based on silicon and LTCC substrates. By using silicon as carrier material, many advantages are obtained including the reduction of thermal stresses between the silicon based die and the packaging surrounding it. The mass of a distributed satellite bus is estimated to be less then 100 grams. Reducing the mass of systems with one to two magnitudes can improve existing mission concepts, but also enable new types of missions, only viable with a low mass high performance spacecraft.