Insitu CMP Monitoring and Control via Pad Surface Friction and Wear Data Collection

摘要

The PadProbe~(TM) has been shown to be a critical insitu monitor of the health and stability of the CMP consumables and processes. A 15μm hydrodynamic lift (water film thickness) was readily determined between the sensor and pad surface. The PadProbe~(TM) provided a direct characterization method for determining the (in) adequacy of the conditioning process to stabilize the pad surface and provide consistent removal rate performance. With PadProbe~(TM) in constant contact with the pad surface during the life of the consumable, it is a "constant on" metrology unit that can provide insight into all factors that provide memory or affect the surface response of the pad. This information has been proven to be invaluable in HVM applications.