DETERMINATION OF ELASTIC MODULI AND POISSON COEFFICIENT OF THINSILICON-BASED JOINT USING DIGITAL IMAGE CORRELATION

摘要

Optical extensometry based on a digital image correlation technique (DIC)is an interestingapproach to the determination of displacements and strains in thin joints.The test specimensconsisted of two monolithic SiC bars assembled by using a silicon-based braze (BraSiC).Theywere tested in four-point bending.Elastic properties of BraSiC are extracted from joint strainstate measured by using DIC and computed using finite element analysis.They are compared toresults of tensile,off-axis compression and nanoindentation tests carried out on similar samples.