【24h】

HVEM study of crack tip dislocations in silicon crystals

机译:HVEM研究硅晶体中的裂纹尖端位错

获取原文

摘要

The present paper describes the nature of crack tip plasticity in silicon crystals examined by high voltage electron microscopy (HVEM) and atomic force microscopy (AFM). Firstly, AFM images around a crack tip are presented, where the formation of fine slip bands with the step heights of one or two nanometers is demonstrated. Secondly, crack-tip dislocations observed by HVEM are exhibited, where it is emphasized that dislocation characterization is essential to consider the relief mechanism of crack-tip stress concentration.
机译:本文介绍了通过高压电子显微镜(HVEM)和原子力显微镜(AFM)检查的硅晶体中裂纹尖端可塑性的性质。首先,给出了裂纹尖端周围的原子力显微镜图像,其中演示了步长为一或两个纳米的精细滑带的形成。其次,展示了通过HVEM观察到的裂纹尖端位错,其中强调位错表征对于考虑裂纹尖端应力集中的缓解机制是必不可少的。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号