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Architecture and design trends for convergence devices wireless communication

机译:会聚设备的架构和设计趋势无线通信

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Summary form only given. With an ever increasing number of complementing and competing wireless standards to be launched worldwide, consumer connectivity becomes a question of having all of the protocols available while being able to actively run just a subset of them at any oven point in time. The complexity of such multi-protocol products clearly challenges the business strategy of the semiconductor industry to provide complete solutions with short time-to-market and leaves OEMs with ever shrinking margins. The author proposes a different value-chain approach where the semiconductor supplier provides an open platform for system integration. A highly efficient C-compiler allows OEMs to integrate their own and 3rd party IP in minimum time and thus provided customized solutions to an increasingly segmented consumer market. Both RF and baseband design considerations are discussed in the light of 90 nm and beyond technologies.
机译:摘要表格仅给出。随着越来越多的补充和竞争无线标准在全球上推出,消费者连接成为拥有所有协议的问题,同时能够在任何烤箱中积极地运行它们的子集。这种多协议产品的复杂性明显挑战了半导体行业的业务战略,为新的时间内提供了完整的解决方案,并留下了萎缩的边缘的OEM。作者提出了一种不同的价值链方法,其中半导体供应商为系统集成提供开放式平台。一个高效的C编译器允许OEM在最短的时间内将自己和第三方IP集成,并因此为日益分段的消费市场提供了定制的解决方案。 RF和基带设计考虑因素均以90nm及超出技术讨论。

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