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A scalable soft spot analysis methodology for compound noise effects in nano-meter circuits

机译:用于纳米电路中复合噪声影响的可扩展软点分析方法

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Circuits using nano-meter technologies are becoming increasingly vulnerable to signal interference from multiple noise sources as well as radiation-induced soft errors. One way to ensure reliable functioning of chips is to be able to analyze and identify the spots in the circuit which are susceptible to such effects (called "soft spots" in this paper), and to make sure such soft spots are "hardened" so as to resist multiple noise effects and soft errors. In this paper, we present a scalable soft spot analysis methodology to study the vulnerability of digital ICs exposed to nano-meter noise and transient soft errors. First, we define "softness" as an important characteristic to gauge system vulnerability. Then several key factors affecting softness are examined. Finally an efficient Automatic Soft Spot Analyzer (ASSA) is developed to obtain the softness distribution which reflects the unbalanced noise-tolerant capability of different regions in a design. The proposed methodology provides guidelines to reduction of severe nano-meter noise effects caused by aggressive design in the pre-manufacturing phase, and guidelines to selective insertion of on-line protection schemes to achieve higher robustness. The quality of the proposed soft-spot analysis technique is validated by HSPICE simulation, and its scalability is demonstrated on a commercial embedded processor.
机译:使用纳米技术的电路越来越容易受到来自多个噪声源的信号干扰以及辐射引起的软错误的影响。确保芯片可靠运行的一种方法是能够分析和识别电路中容易受到这种影响的斑点(在本文中称为“软斑点”),并确保将这些软斑点“硬化”,以便以抵抗多种噪声影响和软错误。在本文中,我们提出了一种可扩展的软点分析方法,以研究暴露于纳米噪声和瞬态软错误的数字IC的脆弱性。首先,我们将“ softness ”定义为衡量系统漏洞的重要特征。然后研究了影响柔软度的几个关键因素。最后,开发了一种高效的自动软点分析器(ASSA),以获得柔软度分布,该分布反映了设计中不同区域的不平衡噪声容忍能力。所提出的方法提供了减少在制造前阶段进行积极设计而导致的严重纳米噪声影响的指南,以及选择性插入在线保护方案以实现更高鲁棒性的指南。通过HSPICE仿真验证了所提出的软点分析技术的质量,并在商用嵌入式处理器上证明了其可扩展性。

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