Development of soy adhesive using aqueous epoxy resins

机译：使用环氧树脂水溶液研制大豆粘合剂

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From FT-IR and DSC, epoxide reacts with SPI. The bond strength of epoxy resin/SPI system have enough strength, which even have the water-resistance to some extent.

机译：来自FT-IR和DSC，环氧化物与SPI反应。环氧树脂/ SPI系统的粘合强度有足够的强度，甚至在一定程度上具有耐水性。

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《Annual meeting of the Adhesion Society》|2016年|614 p.|共2页
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T. Endo; H. Hori; T. Iwata; A. Takemura;
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中图分类工程材料一般性问题;
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入库时间 2022-08-21 04:36:33

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机译：三聚氰胺-乙二醛与环氧树脂交联的大豆基胶粘剂
4. Development of soy adhesive using aqueous epoxy resins [C] . T. Endo, H. Hori, T. Iwata, Annual meeting of the Adhesion Society . 2016

机译：使用水性环氧树脂开发大豆粘合剂
5. Development and characterization of soy-based epoxy resins and pultruded FRP composites. [D] . Zhu, Jiang. 2002

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6. Characterization and Performance of Soy-Based Adhesives Cured with Epoxy Resin [O] . Nairong Chen, Peitao Zheng, Qinzhi Zeng, 2017

机译：环氧树脂固化的大豆基胶粘剂的表征与性能
7. Improvement in Peel-adhesive Properties by Toughening of Epoxy Resins Using Preformed Thermoplastic Polymer ParticlesImprovement in Peel-adhesive Properties by Toughening of Epoxy Resins Using Preformed Thermoplastic Polymer Particles [O] . Hajime KISHI, Kazuhiko UESAWA, Satoshi MATSUDA, 2004

机译：通过使用预成型的热塑性聚合物颗粒加固环氧树脂的剥离粘合性能，通过使用预制的热塑性聚合物颗粒的环氧树脂加固来改善剥离性能

Development of soy adhesive using aqueous epoxy resins

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