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ADHESION IN OVERMOLDING APPLICATIONS

机译:包覆成型应用中的粘附性

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The use of IFGs can lead to melt-to-melt contact in an injection overmolding operation under normal conditions where there is no melting for flat interfaces. By promoting melting, IFGs results in improved adhesion for material combinations where adhesion mechanism is either interdif-fusion or chemical reaction. Thermal modeling allows the IFG to be optimized for a particular situation. For example, density of features, aspect ratio, tip angle, etc. can be easily simulated to determine the structure that is the best compromise between enabling melt-to-melt contact and manufacturability. With right knowledge of the materials and processing, over-molding conditions can be chosen to obtain good adhesion for a variety of applications.
机译:IFG的使用可以在正常条件下在注射超出运行中导致熔融熔融接触,在没有熔化的扁平界面。通过促进熔化,IFGS导致用于材料组合的改善粘附,其中粘合机理是跨性融合或化学反应。热建模允许IFG针对特定情况进行优化。例如,可以容易地模拟特征,纵横比,尖端角等的密度以确定使熔融接触和制造性能够在实现熔融接触和制造性之间的最佳折衷方型。通过对材料和加工的正确了解,可以选择过塑条件以获得各种应用的良好附着力。

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