Investigation of the Influence of Humidity and Temperature on the Crack Growth in Adhesively Bonded Joints under Cyclic Load

摘要

The results indicate that the crack propagation in small-scale DCB specimen under isothermal and iso-humid conditions can be assigned to the continuous ingres-sion of water at the tip of the crack during the experiment. In contrast to bulk specimen, no significant delay between the beginning of exposure and the start of crack propagation could be observed. Using then Eplexor~? DMTA instrument in combination with the Hygromator~? humidity generator has shown to be a valuable configuration for investigating the influence of humidity and temperature on the crack growth in adhesively bonded joints under cyclic load.