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Review and comparison of shearography and active thermography for nondestructive testing and evaluation (NDTE)

机译:用于非破坏性测试和评价的审查和比较,用于非破坏性测试和评估(NDT&E)

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Shearography and active thermography have received considerable industrial acceptance for nondestructive testing & evaluation (NDT&E). They are applicable to all materials: metal, non-metal, composites materials and even biological tissues. The principles and the methods of testing of these two techniques are reviewed, and their advantages and limitations are being compared. Both are optical techniques enjoying the advantages of full-field, non-contact and hence very high inspection speed. A fundamental difference between them is the mechanism of detecting flaws. Shearography is an interference optical technique which measures surface deformation and reveals flaws by looking for flaw-induced deformation anomalies. Active thermography is a surface thermal radiation measuring technique; it used thermal radiation properties to measure the distribution of surface temperature of the object. It detects flaws by the flaw's anomalous heat transfer response. The methods of testing are also different. While shearography requires application of stresses to produce deformation, active thermography needs a controllable thermal radiation excitation to change the surface temperature. Both shearography and active thermography can detect surface and sub-surface flaws, unless the flaw is too remote from the surface. Different excitation methods, such as sonic, induction, flash heating, for the techniques are demonstrated together with some NDT&E applications such as detection of cracks, debonds and other type of flaws.
机译:Shearography和Active Thermoction已经接受了对非破坏性测试和评估(NDT&E)的相当大的工业验收。它们适用于所有材料:金属,非金属,复合材料材料甚至生物组织。综述了这两种技术的原理和测试方法,并进行了优点和局限性。两者都是光学技术,享有全场,非接触的优点,因此非常高的检查速度。它们之间的基本差异是检测缺陷的机制。 Shearography是一种干扰光学技术,通过寻找缺陷诱导的变形异常来测量表面变形并揭示缺陷。有源热成像是一种表面热辐射测量技术;它使用热辐射特性来测量物体的表面温度分布。它通过缺陷的异常传热反应来检测缺陷。测试方法也不同。虽然Shearography需要应用应力以产生变形,但有源热成像需要可控的热辐射激发以改变表面温度。除非缺陷太远离表面,否则剪切术和有源热成像都可以检测表面和亚表面缺陷。不同的激励方法,例如声波,感应,闪蒸加热,用于技术的一些NDT&E应用,例如检测裂缝,借方和其他类型的缺陷。

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