Cost-Competitive Carbon-Based Passive Thermal management Products for Electronics Cooling

摘要

Electronic components are becoming smaller in size and developing unprecedented power dissipation characteristics as processing speeds increase. The state of the art in electronics has moved from individual chips encased in heavy, large protective metal carriers with gull wing leads soldered to a printed wiring board (PWB) to the chips, minus the carrier, being wire bonded directly onto the PWB--chip-on-chip-on-board--or even "flipped" over and bump soldered to the PWB without leads--flip-chip-on-board (FCOB). However, along with the hgiehr electronics packaging density and greater levels of heat dissipation generated by smaller components comes the need to more effectively manage the increasing heat levels generated by these new electronci components.