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Automated head-gimbal assembly procedure for high-performance rigid media disk drives

机译:高性能硬质介质磁盘驱动器的自动磁头万向节组装程序

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The central operation in Head-Gimbal Assembly (HGA) involves bonding the magnetic read-wirite head to the loadbeam (suspension). Generally, the head is bonded onto a flexible gimbal, which is a part of the suspension assembly, using adhesives to obtain desired strength, crown, and conductive properties of the bond-joint. Currently, even though automated processes are utilized to perfomr the bonding operation, lack of understanding regarding the bonding process itself results in unmodeled parameters contributing to variabilities in process capability. Additionally, increasing sensitivities of critical design parameters affecting performance underscore the need for a clear understanding of the mechanics of head-suspension bonding. This paper attempts to study the mechanics of the bonding operation using matheratical models and analyses, and compares them to experimentally obtained results. Finite element and static force analyses are employed to model the mechanics, and the results are used to identify different system parameters.
机译:磁头万向架组件(HGA)的中央操作涉及将磁读写磁头粘结到负载梁(悬架)。通常,使用粘合剂将磁头粘结到作为悬架组件一部分的柔性万向架上,以获得所需的强度,齿冠和粘结接头的导电性能。当前,即使利用自动化过程来执行键合操作,但是对键合过程本身的缺乏理解也会导致未建模的参数,从而导致过程能力的变化。此外,影响性能的关键设计参数的敏感性不断提高,这凸显了对头部悬架粘结机理的清楚了解的必要性。本文尝试使用数学模型和分析方法研究键合操作的机理,并将其与实验获得的结果进行比较。有限元分析和静力分析被用来对力学建模,结果被用来识别不同的系统参数。

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