Efficient use of material and space in miniaturized parts is changing the stress patterns in emerging connector designs. Bending stress applied in the plane of rolling or stamping and torsional stress are examples. There is little information available on spring material performance under these stress conditions when exposed to higher service temperatures.In order to maintain performance reliability, an understanding of material response to compound stress including torsion at elevated temperatures is need.This study compares material stress relaxation performance in simple bending stress and torsional stress environments.
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