Connectors are exposed to more and more severe conditions for example higher temperatures and corrosive environments. At the same time the size is decreasing. Materials with improved properties are needed. The CuNiSi system has obviously the properties looked for. The use of it is growing. The paper will present an overview of the different versions of CuNiSi that are used in USA, Japan and Europe. Special attention will be given to the Outokumpu Copper version. The influence of various thermo mechanical treatments on mechanical properties, formability, stress relaxation resistance and conductivity will be reviewed.
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