The aim of these studies is the integral detection of critical microstructural defects and microcracks in relation to the impact of different heat transfer mechanisms and the temperature difference of an applied thermal shock. Resonant frequency and damping analyses (RFDA) were used to evaluate the changes in Young's modulus and damping (Q~(-1)) due to the number of thermal shock cycles and temperature gradients. The dependence of these changing elastic properties is determined. The verification of microstructural changes and effects is recorded by scanning electron microscopy (SEM).
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