Boron carbide (B_4C) is a covalently bonded compound with a high melting point (2427°C), low density (2.52 g/cm~3), and a high neutron absorption cross section [1], It is also one of the hardest materials (Vickers hardness: 3770 kg/mm~2) and has been used extensively as abrasive grits and wear-resistance components. Boron carbide semiconductor is also a promising material, with its high Seebeck coefficient at high temperatures [2]. Boron carbide ceramics is therefore one of the attractive materials for engeneering components [3].
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机译：碳化硼（B_4C）是一种共价键合的化合物，具有高熔点（2427°C），低密度（2.52 g / cm〜3）和高中子吸收截面[1]，它也是最硬的化合物之一材料（维氏硬度：3770 kg / mm〜2），已被广泛用作磨料和耐磨部件。碳化硼半导体也是一种有前途的材料，在高温下具有很高的塞贝克系数[2]。因此，碳化硼陶瓷是用于制造组件的有吸引力的材料之一[3]。
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