首页> 外文会议>International Conference on Communications;ICC'91 >IMPLEMENTATION OF AN ATM LAYER CHIP FOR B-ISDN APPLICATIONS
【24h】

IMPLEMENTATION OF AN ATM LAYER CHIP FOR B-ISDN APPLICATIONS

机译:B-ISDN应用的ATM层芯片的实现

获取原文

摘要

This paper describes the application and architecture of an experimental research prototype Application Specific Integrated Circuit designed to serve as a generic building block of the future broadband ISDN (B-ISDN).The chip performs common Asynchronous Transfer Mode (ATM) layer functions such as Cell Assembly and Cell Disassembly.A new Media Access Control (MAC) protocol developed for a broadband customer premises network is also integrated in the chip.The chip operation modes are controlled through a microcontroller interface.The chip interfaces to lhe B-ISDN through a SONET STS-3c Framer chip.The ATM Layer chip has been designed using 1.2 μm CMOS technology with a die area of 5.4 mm×5.4mm and approximately 27,000 transistors.At the user network interface,the chip can be used to implement broadband terminal adaptors and the network termination.At the broadband local exchange,the chip can be used in the implementation of cell multiplexers,translators,etc.
机译:本文描述了实验研究原型专用集成电路的应用和体系结构,该集成电路旨在用作未来宽带ISDN(B-ISDN)的通用构建基块。该芯片执行常见的异步传输模式(ATM)层功能,例如Cell组装和单元拆卸:为宽带客户驻地网络开发的新媒体访问控制(MAC)协议也集成在芯片中,芯片操作模式通过微控制器接口控制,芯片通过SONET与B-ISDN接口STS-3c成帧器芯片。ATMLayer芯片采用1.2μmCMOS技术设计,管芯面积为5.4 mm×5.4mm,具有约27,000个晶体管。在用户网络接口处,该芯片可用于实现宽带终端适配器和在宽带本地交换机,该芯片可用于实现单元复用器,转换器等。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号