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Effect of Heat Treatment on Pore Architecture and Associated Property Changes in Plasma Sprayed TBCs

机译:热处理对等离子喷涂TBC孔结构和相关性能变化的影响

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摘要

Plasma sprayed Thermal Barrier Coatings (TBCs) exhibit many interlamellar pores, voids and microcracks. These microstructural features are primarily responsible for the low global stiffnesses and the low thermal conductivities commonly exhibited by such coatings. The pore architecture thus has an important influence on such thermophysical properties. In the present work, the effect of heat treatment (at temperatures up to 1400°C, for times of up to 10 hours) on the pore architecture in detached YSZ top coats has been characterised by Mercury Intrusion Porosimetry (MIP) and gas-sorption techniques. While the overall porosity level remained relatively unaffected (at around 10-12%) after the heat treatments concerned, there were substantial changes in the pore size distribution and the (inter-connected) specific surface area. Fine pores (<~50 nm) rapidly disappeared, while the specific surface area dropped dramatically, particularly at high treatment temperatures (~1400°C). These changes are thought to be associated with intra-splat microcrack healing, improved inter-splat bonding and increased contact area, leading to disappearance of much of the fine porosity. These microstructural changes are reflected in sharply increased stiffness and thermal conductivity. Measured thermal conductivity data are compared with predictions from a recently-developed analytical model [1], using the deduced inter-splat contact area results as input parameters. Good agreement is obtained, suggesting that the model captures the main geometrical effects and the pore size distribution measurements reflect the most significant microstructural changes.
机译:等离子喷涂的热障涂层(TBC)表现出许多层间孔,空隙和微裂纹。这些微观结构特征是造成这种涂层通常表现出的低整体刚度和低热导率的主要原因。因此,孔结构对这种热物理性质具有重要影响。在目前的工作中,热处理(在高达1400°C的温度下,长达10个小时的时间)对分离的YSZ面漆中孔结构的影响已通过汞侵入孔隙率法(MIP)和气体吸附进行了表征。技术。热处理后,虽然整体孔隙率水平保持相对不受影响(约10-12%),但孔径分布和(相互连接的)比表面积却发生了很大变化。细孔(<〜50 nm)迅速消失,而比表面积却急剧下降,特别是在高温(〜1400°C)下。这些变化被认为与板内微裂纹愈合,板间键合改善和接触面积增加有关,从而导致许多细孔的消失。这些微观结构的变化反映在刚度和热导率的急剧增加中。使用推导的跨板接触面积结果作为输入参数,将测得的热导率数据与最近开发的分析模型[1]的预测值进行比较。获得了良好的一致性,表明该模型捕获了主要的几何效应,并且孔径分布测量值反映了最重要的微观结构变化。

著录项

  • 来源
    《 》|2007年|1-6|
  • 会议地点 Beijing(CN);Beijing(CN)
  • 作者

    Lin Qiwei;

  • 作者单位

    Dept of electronic and communication,HuaQiao University,Quanzhou 362021,China;

  • 会议组织
  • 原文格式 PDF
  • 正文语种
  • 中图分类 焊接、金属切割及金属粘接 ;
  • 关键词

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