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Progress on the Pseudo-Binary (Al2O3)3(TiO2)2-System for Surface Passivation of P-Type Silicon

机译:P型硅表面钝化的伪二元(Al2O3)3(TiO2)2-体系的研究进展

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We have reported before on the use of (Al2O3)3(TiO2)1-x pseudo-binary alloys, deposited by spin coating and thermally treated, for field-induced surface passivation of p-type silicon. These layers show fixed negative charge densities in the order of 1012 cm -2 and yield low surface recombination velocities, but the passivating properties are degrading with time. It was found now that a treatment at high temperature (720degC-1000degC) in oxygen substantially reduces this degradation. The influence of temperature, oxygen flow and duration of the treatment on the effective lifetime is studied, as are effects occuring at the PBA/Si interface. A first optimization of this process leads to surface recombination velocities below 150 cm/s on low-resistivity FZ material and around 300 cm/s on CZ months after deposition. Experiments on the exact nature of the degradation mechanism are ongoing
机译:先前我们曾报道过使用(Al 2 O 3 3 (TiO 2 1-x 准二元合金,通过旋涂沉积和热处理,用于p型硅的场致表面钝化。这些层显示出10 12 cm -2 的固定负电荷密度,并且表面复合速度较低,但是钝化性能会随着时间而降低。现在发现,在氧气中在高温(720℃至1000℃)下进行处理可以大大降低这种降解。研究了温度,氧气流量和处理时间对有效寿命的影响,以及在PBA / Si界面上发生的影响。该工艺的第一个优化导致沉积后低电阻率FZ材料的表面复合速度低于150 cm / s,而CZ月的表面复合速度约为300 cm / s。有关降解机理确切性质的实验正在进行中

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