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Using the boundary scan delay chain for cross-chip delay measurement and characterization of delay modeling flow

机译:使用边界扫描延迟链进行跨芯片延迟测量和延迟建模流程的表征

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For ASICs/SOCs/lCs it is often very important to have an easily accessible delay measurements path for several reasons. The delay of a long path running across the whole chip through lots of instances (inverters, MUXes) makes it possible to measure the final process parameters of an ASIC/IC within the best and worst case production process window. This information is very important for production testing and assembly at the vendor site. But very often this information is also necessary at circuit pack level, system test level and even in the field - when in the case of problems (functionality, timing, debugging) it should be known which "quality level" the ASIC/IC device has reached. Also for characterization of the delay modeling during the different design phases (estimation, floorplanning, trial and final layout) such a dedicated delay path may help in qualifying the delay models. We propose to use a new standard methodology to address these issues by definition of a dedicated delay path. It is called "Boundary Scan Delay Chain" (BSDC). We use the Boundary Scan data register according to IEEE1149.1 to get a delay chain across the chip. Only a slight modification of the boundary scan cell (e.g. BC 1, BC 4) is necessary. The resulting new functionality still conforms to IEEE1149.1.
机译:对于ASIC / SOC / IC,由于多种原因,拥有易于访问的延迟测量路径通常非常重要。经过很多实例(反相器,MUX)的整个芯片上的长路径的延迟使在最佳和最坏情况下的生产过程窗口内测量ASIC / IC的最终过程参数成为可能。此信息对于在供应商站点进行生产测试和组装非常重要。但是,在电路板级,系统测试级甚至在现场,通常也需要此信息-在出现问题(功能,时序,调试)的情况下,应该知道ASIC / IC器件具有哪个“质量级”到达。同样,为了表征不同设计阶段(估算,布局规划,试验和最终布局)中的延迟模型,这种专用延迟路径可能有助于验证延迟模型。我们建议使用一种新的标准方法,通过定义专用的延迟路径来解决这些问题。它称为“边界扫描延迟链”(BSDC)。我们使用符合IEEE1149.1的边界扫描数据寄存器来获得整个芯片的延迟链。边界扫描单元(例如BC 1,BC 4)仅需稍作修改。产生的新功能仍符合IEEE1149.1。

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