K-band receiver front-end IC integrating micromachined filter and flip-chip assembled active devices

摘要

A novel three-dimensional K-band receiver front-end IC was developed in which a micromachined low-loss filter and flip-chip devices ware integrated on a silicon substrate. An inverted microstrip line and a new resonator are newly introduced in the filter. Multilayered BCB and flip-chip bonding technologies are also adopted.