Modeling and minimization of intercascade thermal resistance in multi-stage thermoelectric cooler

摘要

The problem of achieving highest temperature difference /spl Delta/T in cascade thermoelectric cooler (TEC) is solved with consideration of intercascade thermal resistance. The model of three-dimensional heat spread in substrates is considered. Existence of substrate optimum thickness corresponding to highest /spl Delta/T is established. It is shown that correct choice of substrate configuration permits to receive considerable increase in TEC efficiency. In particular, it concerns short-legged TECs having extremely high heat flux densities.