首页> 外文会议> >Impact of metal overhang and guard ring techniques on breakdown voltage of Si strip sensors - 2003 IEEE nuclear science symposium, medical imaging conference, and workshop of room-temperature semiconductor detectors
【24h】

Impact of metal overhang and guard ring techniques on breakdown voltage of Si strip sensors - 2003 IEEE nuclear science symposium, medical imaging conference, and workshop of room-temperature semiconductor detectors

机译:金属悬伸和保护环技术对Si条形传感器击穿电压的影响-2003 IEEE核科学研讨会,医学影像会议和室温半导体探测器研讨会

获取原文

摘要

The importance of Si sensors in high-energy physics (HEP) experiments can hardly be overemphasized. However, the high luminosity and the high radiation level in the future HEP experiments, like Large Hadron Collider (LHC), has posed a serious challenge to the fabrication of Si detectors. For the safe operation over the full LHC lifetime, detectors are required to sustain very high voltage operation, well exceeding the bias voltage needed to full deplete the heavily irradiated Si sensors. Thus, the main effort in the development of Si sensors is concentrated on a design that avoids p-n junction breakdown at operational biases. Among various proposed techniques, Field-limiting Ring (FLR) (or guard ring) and Metal-Overhang (MO) are technologically simple and are suitable for vertical devices. Since high-voltage planar Si junctions are of great importance in the HEP experiments, it is very interesting to compare these two aforementioned techniques for achieving the maximum breakdown voltage under optimal conditions. In the present work, the breakdown performance of metal-overhang and field-limiting ring techniques is compared for various values of junction depth and fixed oxide charge under similar conditions using two dimensional device simulation program TMA-MEDICI.
机译:Si传感器在高能物理(HEP)实验中的重要性很难被过分强调。但是,像大型强子对撞机(LHC)一样,未来的HEP实验中的高发光度和高辐射水平对Si检测器的制造提出了严峻的挑战。为了在LHC的整个使用寿命内实现安全运行,要求检测器保持非常高的电压运行,远远超过完全耗尽严重辐照的Si传感器所需的偏置电压。因此,Si传感器开发的主要工作集中在避免操作偏置下p-n结击穿的设计上。在各种提议的技术中,场限制环(FLR)(或保护环)和金属悬垂(MO)在技术上都很简单,适用于垂直设备。由于高压平面Si结在HEP实验中非常重要,因此比较这两种前述的在最佳条件下实现最大击穿电压的技术非常有趣。在目前的工作中,使用二维器件仿真程序TMA-MEDICI,比较了在相似条件下,对于不同的结深度和固定氧化物电荷值,金属悬伸和场限制环技术的击穿性能。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号