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ATRS: an alternative roadmap for semiconductors, technology evolution and impacts on system architecture

机译:ATRS:半导体,技术发展以及对系统架构的影响的替代路线图

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Summary form only given. The recent evolution of semiconductor technology, in the last decades, brought tremendous improvements in performance increase at decreasing prices, perfectly following the famous Moore's law. Lithography is still improving and allows 0.7/spl times/ linear shrink per technology node. However, many products are hitting the "power wall"! Silicon is free, but peak power consumption, power density, heat dissipation are preventing a straight usage of the available silicon area. The simple shrink, even if it is a perfect way for cost reduction, does not support power density increase, and is not supported by packaging technology which does not scale as fast as silicon. On the other hand, scaling allows to double transistor count at each node at constant die size: then the challenge for tomorrow consists in improving performance while maintaining a reasonable power consumption. Architects and designers must improve MOPS/Watt. In the old times, VDD was scaled by 0.7, so there was enough room to increase both complexity and clock frequency. This talk presents an "alternative roadmap" which is proposing a way to maintain power consumption stable (from today and forever): increase complexity as much as allowed by lithography, implementing a lot of parallelism at decreased clock frequency, with a moderate VDD scaling. There is a big impact on parallel architectures, memory hierarchy, and a bigger impact on device characteristics. We'll demonstrate that device performance must be relaxed compared to the ITRS roadmap, allowing to handle the leakage power crisis and to manage the huge problems due to technology variations. Low frequency and/or asynchronous operating modes are seen as mandatory ways for power management.
机译:仅提供摘要表格。在过去的几十年中,半导体技术的最新发展极大地提高了性能,而价格却不断下降,完全遵循了著名的摩尔定律。光刻技术仍在进步,每个技术节点允许0.7 / spl次/线性收缩。但是,许多产品正在冲击“力量墙”!硅是免费的,但是峰值功耗,功率密度和散热会阻止直接使用可用硅区域。即使是降低成本的完美方法,这种简单的收缩也不支持功率密度的提高,并且封装技术不能像硅那样快速地支持这种简单的收缩。另一方面,按比例缩放允许在不变的芯片尺寸下使每个节点的晶体管数量增加一倍:那么,未来的挑战在于在保持合理功耗的同时提高性能。建筑师和设计师必须改进MOPS / Watt。在过去,VDD的缩放比例为0.7,因此有足够的空间来增加复杂度和时钟频率。该演讲提出了一个“替代路线图”,该路线图提出了一种保持功耗稳定的方法(从今天起直到永远):在光刻技术允许的范围内增加复杂度,在降低的时钟频率下实现许多并行度,并采用适度的VDD缩放。这对并行体系结构,内存层次结构有很大影响,而对设备特性的影响更大。我们将证明,与ITRS路线图相比,必须放宽设备性能,以便处理泄漏功率危机并管理由于技术变化而引起的巨大问题。低频和/或异步操作模式被视为电源管理的强制方式。

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