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Pump characteristic based optimization of a direct water cooling system for a 10 kW/500 kHz Vienna rectifier

机译:基于泵特性的10 kW / 500 kHz Vienna整流器直接水冷系统的优化

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A high power density 10 kW/500 kHz three-phase PWM rectifier (Vienna Rectifier) is under development. Due to preliminary measurements and numerical simulations the total efficiency is assumed to be 95% at full load, resulting in power losses of up to 150 W in each multi-chip power module realizing a bridge leg of the rectifier. In order to keep the power density of the system high direct water cooling is employed where water is in direct contact with the module base plate. Based on the measured characteristic of the water pump (pressure drop dependent on water flow) the geometry of different water channel structures below the module base plate is systematically optimized based on analytical expressions which are formulated based on the well-established theory of fluid dynamics. The design optimization is constrained by the desire to keep the geometry of the water channels in a range that allows simple and low-cost manufacturing. The aim is to find a channel structure resulting in a minimum thermal resistance of the power module for a given pump characteristic. In this paper a very simple slot channel is investigated. The dependency of the thermal resistance on the cooling system is calculated in dependency on the height of the slot channel, and an optimized channel height is found under the side condition of simple manufacturability. Discussing the shortcomings of the simple slot structure, a novel metallic inlay structure is introduced and optimized resulting in a reduction of the thermal resistance of the direct water cooling scheme as compared to the slot channel system. All theoretical considerations are verified via experimental measurements. The general optimization scheme introduced in this paper can easily be adapted to other cooling problems.
机译:高功率密度10 kW / 500 kHz三相PWM整流器(Vienna Rectifier)正在开发中。由于进行了初步的测量和数值模拟,假定在满负载下的总效率为95%,从而在每个多芯片电源模块中实现了整流器的桥臂,从而导致高达150 W的功率损耗。为了保持系统的功率密度,在水与模块基板直接接触的情况下,应采用高度直接的水冷却。基于水泵的测量特性(取决于水流​​量的压降),基于基于成熟的流体动力学理论制定的解析表达式,系统地优化了模块底板下方不同水通道结构的几何形状。将水道的几何形状保持在允许简单且低成本制造的范围内的要求限制了设计优化。目的是找到一种通道结构,从而在给定的泵特性下使功率模块的热阻最小。本文研究了一个非常简单的时隙信道。根据槽通道的高度来计算热阻对冷却系统的依赖性,并且在简单可制造性的条件下找到最佳的通道高度。在讨论简单缝隙结构的缺点时,引入了一种新颖的金属镶嵌结构并对其进行了优化,与缝隙通道系统相比,该方法降低了直接水冷方案的热阻。所有的理论考虑都通过实验测量得到了验证。本文介绍的一般优化方案可以轻松地适应其他冷却问题。

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