The future of electronic packaging for solid state power technology: the transition of E-packaging to electromechanical engineering

摘要

The future of solid state power conversion is inextricably linked to a joining of disciplines both in its past and even more so in it's future. For the future development of technologies central to solid state power conversion the mechanical-thermodynamic-electrodynamic manufacturing process disciplines have to be coordinated to become a new discipline with an old name: electromechanical engineering. The misleading and disparaging term of electronic packaging bears very little descriptive intent for the job that these engineers and scientists do today and even less when addressed to what they must do in the future. This paper describes future technology drivers and recommends core areas of innovation and future research for five areas of the electromechanical and solid state power assembly disciplines; power assembly topologies, engineering mechanics, thermodynamics, electrodynamics, and process/manufacturing design.