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Defect in optoelectronic packaging due to phosphorus content of the underlayer coating

机译:由于底层涂层中的磷含量,导致光电包装出现缺陷

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This study has led to an important finding that one of the primary causes for cracks in the laser-welded Au-coated optoelectronic materials is due to the existence of the plating layer during the final stage of solidification. Therefore, it is strongly recommended that a Ni underlayer coating without P content should be used prior to the Au plating to prevent crack formation in laser-welded Au coated optoelectronic packaging.
机译:这项研究导致了一个重要发现,即激光焊接镀金的光电材料中产生裂纹的主要原因之一是由于在固化的最后阶段存在镀层。因此,强烈建议在Au镀层之前使用不含P含量的Ni底层涂层,以防止在激光焊接的Au镀层光电封装中形成裂纹。

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