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Dynamic finite element analysis simulation of the terminal crimping process

机译:端子压接过程的动态有限元分析仿真

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The lead time in order to develop the ideal terminal crimp, for low energy applications, is quite extensive. The terminal grip must first be designed, prototype tooled and the crimp specification developed and tested prior to approval and release. The factors of grip design, terminal material and crimp tooling, that govern the formation of a "good" crimp are also not clearly understood. In this study finite element analysis was used to simulate the crimping process, in order to better understand the underlying factors that govern crimp formation. FEA models were created using the ABAQUS program. In order to simplify the study, this work was conducted using two (2) and three (3) dimensional models. The terminal grip cross section, the punch tooling and the wire strands were modeled. In the FEA simulation, the grip was forced into the punch while sitting on the anvil. This mimics the real life application. The initial results of the study have shown that the friction between the grip surface and the punch surface is crucial to the formation of a "good" crimp. The models also showed that the crimping process is a combination of both the plane stress and plane strain conditions.
机译:为了开发适用于低能耗应用的理想端子压接的交货时间非常长。在批准和发布之前,必须首先设计端子夹,设计原型工具并开发和测试压接规格。握柄设计,端子材料和压接工具的因素也决定了“良好”压接的形成,这一点也不清楚。在这项研究中,有限元分析被用来模拟压接过程,以便更好地理解控制压接形成的潜在因素。使用ABAQUS程序创建了FEA模型。为了简化研究,这项工作是使用两(2)和三(3)维模型进行的。对端子夹头的横截面,冲压工具和线束进行了建模。在FEA模拟中,将夹具放在砧座上时将其压入冲头中。这模仿了现实生活中的应用程序。研究的初步结果表明,握持表面和冲头表面之间的摩擦对于形成“良好”的压接至关重要。模型还表明,压接过程是平面应力和平面应变条件的结合。

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