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XRD Stress Analysis of Nano-diamond Coatings on WC-Co Substrates

机译:WC-Co基底上纳米金刚石涂层的XRD应力分析

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Residual stresses in diamond coatings grown on WC-Co substrate have been investigated byrnX-ray diffraction (XRD) method. Nano-diamond coatings were deposited by microwavernplasma-enhanced chemical vapor deposition technique (MP-CVD). To measure residual stress,rnwe tried different peak selection and instrument setting mode (χ mode and ω mode). For gettingrnreliable residual stress value, sin2ψ-method with omega-tilting mode (χ=0) was employed. Thern(311) plane of CVD diamond was used with tilting angle (ψ) from -40 to 40 degrees. Arncompressive stress of 1.65GPa was obtained by linear fitting the mean d-spacing values ofrnpositive and negative tilting. The occurrence of “ψ-splitting” demonstrates the existence ofrnnon-zero shear stress normal to the surface.
机译:通过rnX射线衍射(XRD)方法研究了在WC-Co基体上生长的金刚石涂层中的残余应力。通过微波等离子体增强化学气相沉积技术(MP-CVD)沉积纳米金刚石涂层。为了测量残余应力,我们尝试了不同的峰选择和仪器设置模式(χ模式和ω模式)。为了获得可靠的残余应力值,采用了ω-倾斜模式(χ= 0)的sin2ψ方法。使用CVD金刚石的(311)平面,倾斜角(ψ)为-40至40度。通过线性拟合正和负倾斜的平均d间距值获得1.65GPa的Ar压缩应力。 “ψ-分裂”的出现表明存在垂直于表面的非零剪切应力。

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