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Wide band laser-plasma soft X-ray source using a gas puff target for direct photo-etching of polymers

机译:宽带激光等离子软X射线源,使用气孔靶直接对聚合物进行光蚀刻

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摘要

Organic polymers (PMMA, PTFE, PET, and PI) are considered as the important materials in microengineering, especially for biological and medical applications. Micromachining of such materials is possible with the use of different techniques that involve electromagnetic radiation or charged particle beams. Another possibility of high aspect ratio micromachining of PTFE is direct photo-etching using synchrotron radiation. X-ray and ultraviolet radiation from other sources, for micromachining of materials by direct photo-etching can be also applied. In this paper we present the results of investigation of a wide band soft X-ray source and its application for direct photo-etching of organic polymers. X-ray radiation in the wavelength range from about 3 nm to 20 nm was produced as a result of irradiation of a double-stream gas puff target with laser pulses of energy 0.8 J and time duration of about 3 ns. The spectra, plasma size and absolute energies of soft X-ray pulses for different gas puff targets were measured. Photo-etching process of polymers irradiated with the use of the soft X-ray radiation was analyzed and investigated. Samples of organic polymers were placed inside a vacuum chamber of the x-ray source, close to the gas puff target at the distance of about 2 cm from plasmas created by focused laser pulses. A fine metal grid placed in front of the samples was used as a mask to form structures by x-ray ablation. The results of photo-etching process for several minutes exposition with 10Hz repetition rate were presented. High ablation efficiency was obtained with the use of the gas puff target containing xenon surrounded by helium.
机译:有机聚合物(PMMA,PTFE,PET和PI)被认为是微工程中的重要材料,特别是对于生物和医学应用。通过使用涉及电磁辐射或带电粒子束的不同技术,可以对此类材料进行微加工。 PTFE高深宽比微加工的另一种可能性是使用同步加速器辐射进行直接光蚀刻。也可以应用其他来源的X射线和紫外线辐射,通过直接光蚀刻对材料进行微加工。在本文中,我们介绍了宽带软X射线源的研究结果及其在有机聚合物直接光蚀刻中的应用。通过用能量为0.8 J的激光脉冲并持续约3 ns的时间对双流气吹靶进行辐照,产生了约3 nm至20 nm波长范围的X射线辐射。测量了不同气体靶标的软X射线脉冲的光谱,等离子体尺寸和绝对能量。分析和研究了使用软X射线辐射照射的聚合物的光蚀刻工艺。将有机聚合物样品放置在X射线源的真空室内,靠近抽气目标,距离聚焦激光脉冲产生的等离子体约2 cm。放置在样品前面的细金属格栅用作掩模,以通过X射线烧蚀形成结构。给出了以10Hz重复频率曝光几分钟的光蚀刻过程的结果。使用含有被氦气包围的氙气的气嘴靶可获得较高的消融效率。

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