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Microstructural evolution and mechanical behavior of nickel-based superalloy 625 made by selective laser melting

机译:选择性激光熔炼镍基高温合金625的组织演变和力学行为

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The mechanical properties and microstructures of Selective Laser Melted (SLM) alloy 625 procured from different suppliers were compared. The post-SLM process of hot isostatic pressing (HIP) led to a relatively coarse recrystallized gamma matrix phase that was similar in all the suppliers' materials, resulting in nearly identical tensile properties. These similarities obscure significant differences between them with respect to the population of second phase particles, which consisted of carbides or Laves phase. During solidification, the final liquid phase is concentrated in Nb, Mo, Si and C, and leads to L → γ + carbide/Laves eutectic reactions. Secondary particles are very small prior to HIP and their composition has not been analyzed yet, but are limited to the fine-grained eutectic regions of the material prior to HIP. During HIP the gamma phase recrystallizes to remove the original as-solidified SLM microstructure, but secondary particles nucleate and grow where their elemental constituents first solidified, leading to a non-homogeneous distribution. Quasi-static tensile properties do not appear to be sensitive to these differences, but it is likely that other mechanical properties will be affected, especially fatigue and fracture behavior. Surface roughness, large grain size, and pores and voids left unhealed by the HIP cycle will also influence fatigue and fracture. Surface roughness and porosity in particular are features that could be improved by implementing novel approaches to laser processing in SLM.
机译:比较了从不同供应商处购买的选择性激光熔融(SLM)合金625的机械性能和显微组织。 SLM后的热等静压(HIP)过程导致相对较粗的重结晶γ基质相,该相在所有供应商的材料中都相似,从而导致几乎相同的拉伸性能。这些相似之处掩盖了它们之间相对于由碳化物或Laves相组成的第二相粒子的数量之间的显着差异。在凝固过程中,最终液相集中在Nb,Mo,Si和C中,并导致L→γ+碳化物/ Laves共晶反应。在HIP之前,次级粒子非常小,尚未对其成分进行分析,但仅限于在HIP之前材料的细共晶区域。在HIP过程中,γ相会重结晶以去除原始的凝固SLM微观结构,但次级粒子会成核并生长,在其元素成分首先凝固的位置处生长,导致分布不均匀。准静态拉伸性能似乎对这些差异不敏感,但是其他机械性能(尤其是疲劳和断裂行为)可能会受到影响。表面粗糙度,大晶粒尺寸以及HIP循环无法治愈的孔隙和空隙也会影响疲劳和断裂。特别是表面粗糙度和孔隙率可以通过在SLM中实施新颖的激光加工方法来改善。

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