In-Situ Electrical Monitoring and contactless Measurement Techniques for Enhanced FIB Modifications

摘要

Recent planar technologies with 3 metal layers or more challenge current physical design modification capacities using Focused Ion Beam tools. Imae visibility on hte FIB is drastically reduced, making accurate positioning and milling operations in the area of interest more difficult, and the use of power planes increases the risk of short circuits while accessing inferior metal lines. Despite the complexity of FIB modifications, however, thedemand forcircuit modificatiosn continues to increase.