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On The Thermal Excited Resonant Silicon Micro Structural Pressure Sensor

机译:关于热激发共振硅微结构压力传感器

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Some important features of a thermal excited resonant silicon micro structural pressure sensor are discussed in this paper. Its sensing component is a silicon bossed structure, whose preliminary sensing unit is a square silicon diaphragm; the final sensing unit is a silicon beam resonator. Based on the thermally exciting and piezoresistive detecting means of the above silicon sensor, the operating mechanism, signal transferring process and the amplitude and phase conditions of the self-exciting closed loop system are analyzed for the above silicon sensor. The model of the average temperature-rise of the beam resonator is presented, which is caused by the thermal exciting resistor and detecting resistor. The output frequency characteristics of the beam resonator of the silicon sensor are obtained, under considering the comprehensive action of the applied pressure and the constant temperature-rise.
机译:本文讨论了热激发共振硅微结构压力传感器的一些重要特征。它的传感组件是硅凸台结构,其初步传感单元是方形硅膜片;最终的感应单元是硅束谐振器。基于上述硅传感器的热激励和压阻检测装置,分析了上述硅传感器的工作机理,信号传输过程以及自激闭环系统的幅度和相位条件。提出了由热激励电阻和检测电阻引起的电子束谐振器平均温升模型。考虑到施加压力和恒定温度上升的综合作用,获得了硅传感器的束谐振器的输出频率特性。

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