首页> 外文会议>International Symposium on Metastable, Mechanically Alloyed and Nanocrystalline Materials(ISMANAM 2004); 20040822-26; Sendai(JP) >Solid-State Synthesis of Mg_2Si_(1-x)Y_x(Y=Ge and Sn) Thermoelectric Materials via Bulk Mechanical Alloying
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Solid-State Synthesis of Mg_2Si_(1-x)Y_x(Y=Ge and Sn) Thermoelectric Materials via Bulk Mechanical Alloying

机译:块体机械合金化法固相合成Mg_2Si_(1-x)Y_x(Y = Ge and Sn)热电材料

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摘要

Magnesium base compounds and their solid solution have a promising potential as a thermoelectric material to be working in the middle-temperature range of 500 to 800K. In the present study, intrinsic Mg_2Si_(1-x)Y_x(Y=Ge and Sn; x=0, 0.2, 0.4, 0.6, 0.8 and 1.0) semi-conductive materials are successfully synthesized by the bulk mechanical alloying (BMA) at room temperature, starting from the elemental powder mixture. XRD and DTA techniques are used to describe the solid reaction process during BMA. The BMA specimens were further consolidated by the hot pressing (HP) at 773K by 1 GPa for 3.6ks for direct measurement of thermoelectric properties. Temperature dependence of the electrical conductivity, the Seebeck coefficient and thermal conductivity for both Mg_2Si_(1-x)Ge_x and Mg_2Si_(1-x)Sn_x were measured from the room temperature up to 700K. With increasing temperature, the electrical conductivity increased, the Seebeck coefficient and thermal conductivity decreased. The changes of the thermoelectric properties were also investigated for various Ge and Sn concentration. The thermoelectric properties were sensitive to the Ge and Sn concentration. The p-n conversion takes place at the vicinity of x=0.35 for Mg_2Si_(1-x)Ge_x and x=0.2 for Mg_2Si_(1-x)Sn_x. The figure of merit of Mg_2Si_(0.6)Ge_(0.4) in Mg-Si-Ge system reached 0.34 X 10~(-3) K~(-1) at 610K and Mg_2Si_(0.4)Sn_(0.6) in Mg-Si-Sn system reached 0.19 X 10~(-3)K~(-1) at 653K.
机译:镁基化合物及其固溶体作为热电材料,有望在500至800K的中温范围内工作。在本研究中,本征Mg_2Si_(1-x)Y_x(Y = Ge and Sn; x = 0,0.2,0.4,0.6,0.8和1.0)的半导电材料已成功通过BMA合成。室温,从元素粉末混合物开始。 XRD和DTA技术用于描述BMA期间的固相反应过程。通过在773K下以1 GPa的热压(HP)进行3.6ks的热压(HP)进一步固结BMA标本,以直接测量热电性能。从室温到700K均测量了Mg_2Si_(1-x)Ge_x和Mg_2Si_(1-x)Sn_x的电导率,塞贝克系数和热导率的温度依赖性。随着温度的升高,电导率增加,塞贝克系数和热导率降低。还研究了各种Ge和Sn浓度下热电性能的变化。热电性质对Ge和Sn浓度敏感。对于Mg_2Si_(1-x)Ge_x,p-n转换发生在x = 0.35附近,对于Mg_2Si_(1-x)Sn_x,x = 0.2发生。 Mg-Si-Ge体系中Mg_2Si_(0.6)Ge_(0.4)的品质因数在610K时达到0.34 X 10〜(-3)K〜(-1),Mg-Si中的Mg_2Si_(0.4)Sn_(0.6) -Sn系统在653K时达到0.19 X 10〜(-3)K〜(-1)。

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