首页> 外文会议>International symposium on liquid metal processing amp; casting 2013 >IMPACT OF THE SOLIDIFIED SLAG SKIN ON THE CURRENT DISTRIBUTION DURING ELECTROSLAG REMELTEVG
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IMPACT OF THE SOLIDIFIED SLAG SKIN ON THE CURRENT DISTRIBUTION DURING ELECTROSLAG REMELTEVG

机译:凝固后的渣皮对电滞后的电流分布的影响

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摘要

The ESR process is commonly used to produce defect-free ingots of high added value alloys such as special steels or Ni-based superalloys. Numerous simulation tools have been developed for the last 30 years to get better insight into the process and help its optimization. Most assume that no electrical current is able to cross the solidified slag skin and flow in the water-cooled mold. However, it has recently been claimed that the slag skin does not ensure perfect insulation, which is prone to modify the current distribution, hence some of the results previously assessed. This paper presents the assumptions made to simulate that phenomenon and some results in terms of current flow into the mold, depending on the thickness and electrical conductivity of the solidified slag skin. Results show that both parameters can have a great influence on the current distribution, hence the slag behaviour and final ingot quality.
机译:ESR工艺通常用于生产高附加值合金(如特种钢或Ni基高温合金)的无缺陷铸锭。在过去的30年中,已经开发了许多仿真工具,以更好地了解过程并帮助对其进行优化。大多数人认为没有电流能够穿过凝固的渣皮并在水冷模具中流动。然而,最近声称,渣皮不能确保完美的绝缘,这容易改变电流分布,因此先前评估了一些结果。本文介绍了模拟该现象的假设,并根据凝固炉渣表皮的厚度和电导率,根据流入铸模的电流得出了一些结果。结果表明,这两个参数都对电流分布有很大的影响,因此,渣的行为和最终铸锭的质量。

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