首页> 外文会议>International Symposium on Fundamentals of Deformation and Annealing; 20060905-7; Manchester(GB) >Recrystallization Texture of Copper as a Function of Layer Thickness in Roll-Bonded Cu-Nb Composites
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Recrystallization Texture of Copper as a Function of Layer Thickness in Roll-Bonded Cu-Nb Composites

机译:滚压结合的Cu-Nb复合材料中铜的再结晶织构与层厚度的关系

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The extraordinary strength values of composites with nano-scale layers or phases have inspired much investigation into the strengthening mechanisms of laminated composites such as Cu-Nb. The annealed microstructure and texture of any material govern its mechanical properties in composites just as much as in single-phase materials yet studies on the development of annealing textures of such deformed layered composites are still very limited as compared to studies of strengthening mechanisms. Recrystallization textures of monolithic pure Cu and alloyed Cu -C19210 as well as when they are reinforced with Nb using roll-bonding are investigated. The roll-bonded samples of different layered length scales were deformed to reductions of 70-90% and annealed at 300℃ and 800℃ for 0.5 hours. We found that the Cube and R-orientation {124} < 211 > were the dominant components in the recrystallized texture of monolithic pure Cu and alloyed Cu respectively. However, retained rolling texture was obtained for the sub-micron Cu layers of the composites. X-ray analysis and EBSD was used to study the recrystallization evolution of the Cu in the composites. EBSD in particular was also used to observe recrystallization for the sub-micron Cu layers. In this paper we also discuss the effect of the length scale of the Cu layer thickness on the recrystallized texture especially in the sub-micron range.
机译:具有纳米级层或相的复合材料的非凡强度值激发了人们对诸如Cu-Nb的层压复合材料的强化机理的大量研究。与单相材料一样,任何材料的退火组织和结构都可控制其机械性能,而与强化机理的研究相比,这种变形层状复合材料的退火纹理发展的研究仍然非常有限。研究了整体式纯Cu和合金Cu -C19210的再结晶织构以及当采用辊压结合Nb增强时的重结晶织构。将不同层长尺度的辊压粘合样品变形至压下率降低70-90%,并在300℃和800℃下退火0.5小时。我们发现立方晶和R取向{124} <211>分别是单块纯Cu和合金Cu的重结晶织构中的主要成分。然而,对于复合材料的亚微米Cu层,获得了保留的滚动织构。 X射线分析和EBSD用于研究复合材料中Cu的重结晶过程。尤其是,EBSD还用于观察亚微米Cu层的重结晶。在本文中,我们还讨论了铜层厚度的长度尺度对再结晶织构的影响,尤其是在亚微米范围内。

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