Control of grain depth of cut in ductile mode grinding of brittle materials and practical application

摘要

It is a fundamental condition for ductile mode grinding of brittle materials that grain depth of cut is controlled to be less than ductile - brittle transition in uncut chip thickness d_c. The condition means that distribution of protrusion heights of active grains must be controlled to be less than d_c. However it is more difficult for coarse abrasive wheel than for fine abrasive wheel. The deveopment of ductile mode grinding of brittle materials with coarse abrasive diamond wheel is important for the technology to be applicable for the machining process of brittle materials requiring high profile generation capability and productivity. This paper shows that ductile mode grinding of brittle materials can be achieved with coarse abrasive diamond wheel with abrasive size of 20 mum. For a example the surface roughness of ground borosilicate glass is 0.75 nm in R_a and 8.64 nm in R_y.