Innovative solutions in power electronics. A fully integrated intelligent driver for automotive DC motors and application hints

摘要

The semiconductor market is gaining ground day by day in the automotive market. In a time of fast technology advancement, "Smart power" Technologies represent an answer to the ever-increasing market demand of System on Silicon and system on package. Carmakers and electronic module makers find a more effective answer to their needs in these state of the art technologies. They in fact offer big advantages in terms of: technological innovation, economic convenience, reliability and respect of the environmental norms. Thanks to the continuous technological improvement and to innovative solution for package we are now allowed to talk about "system on package", that is, housing different piece of silicon on the same package. This allows us to make concrete the "Mechatronic" approach. That is a complete integration inside the same module of mechanical, electric, electronic and informatics components. Mechatronic solution helps designer to move from a centralized approach to a distributed one, driving to a well-distributed density of power and a considerable wiring reduction. This paper discusses a power H-Bridge application, and shows a comparison between the traditional solutions (relays or discrete solution) and an innovative one that allows to carry out a complete H-bridge in a single power package; together with protections and diagnostic features able to give feedback to a micro. Thermal consideration will be added so to optimize power dissipation through the system composed by an SMD package + PCB. EMI measurement will be provided and discussed so to prevent any interference with other electronic system present in a car.