首页> 外文会议>International Conference on Superplasticity in Advanced Materials(ICSAM 2003); 20030728-30; Oxford(GB) >Advances in Manufacturing Superplastically Formed and Diffusion Bonded Components
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Advances in Manufacturing Superplastically Formed and Diffusion Bonded Components

机译:超塑成型和扩散粘结零件的制造进展

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This paper will discuss some of the advances that have been made at Boeing Commercial Airplanes to manufacture production and research Superplastically Formed and Diffusion Bonded (SPF/DB) structure. Even though SPF/DB has been in production for over twenty years, challenges have been encountered that need solutions before the process can see wide spread acceptance. Airplane engineers, designers and stress analysts, need to be assured that the process will yield quality hardware that meets structural requirements. However, the engineers must have requirements that are realistic. For example, if there are areas that can tolerate non-bonds of a certain size and still be structurally acceptable, then the drawing should be zoned accordingly. One of the main concerns is the diffusion bond quality that is achieved and how can this be determined without destructively evaluating each part. Also of interest is the weight of the part since titanium is being used for SPF/DB and the structure does not always need this material to meet requirements. A key element of the weight issue is the thickness needed to meet structural requirements. Fortunately, with Finite Element Modeling, the proposed SPF/DB geometry can be modeled and the thicknesses predicted. An estimated weight can now be determined and a decision made whether steps need to be taken to reduce the weight in order to be competitive with other fabrication technologies. After SPF/DB has been selected as the manufacturing method of choice, the hardware needs to be fabricated so that quality is achieved throughout the entire process and the engineering requirements are met.
机译:本文将讨论波音民用飞机在制造和研究超塑性成形和扩散粘结(SPF / DB)结构方面的一些进展。尽管SPF / DB的生产已经有20多年了,但是在过程被广泛接受之前,仍遇到了需要解决方案的挑战。飞机工程师,设计师和压力分析人员需要确保该过程将产生满足结构要求的高质量硬件。但是,工程师必须具有切合实际的要求。例如,如果存在可以忍受一定大小的非粘结且仍在结构上可接受的区域,则应相应地对图纸进行分区。主要问题之一是所达到的扩散键质量,以及如何在不破坏性评估每个部件的情况下确定扩散键质量。由于钛用于SPF / DB,并且结构并不总是需要这种材料来满足要求,因此部件的重量也是令人感兴趣的。重量问题的关键要素是满足结构要求所需的厚度。幸运的是,通过有限元建模,可以对建议的SPF / DB几何进行建模并预测厚度。现在可以确定估计的重量,并做出是否需要采取措施减轻重量以与其他制造技术竞争的决定。在选择SPF / DB作为选择的制造方法之后,需要制造硬件,以便在整个过程中都达到质量并满足工程要求。

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